Success story in the area of industrial automotion: Modern electronic systems are becoming ever smaller and more difficult to test and inspect. The recent advances towards 3D chip technology with multi-die and many layered devices demands new methods for inspection and reliability testing. Roadmaps such as ITRS have indicated that new methods for metrology to test manufactured devices are urgently required. For defect detection throughout the lifetime of automotive electronics systems is difficult and provides challenges to maintain the reliability required by the public to help exceed customer expectations.
The main objectives were the integration of 2D and 3D acoustic image processing algorithms in order to speed up failure detection and analysis execution times in validation and test labs.
Read out the results of this TTP at: Funded projects > New TTPs > Delphi